This work introduces an unpublished technique for extracting data from flash memory chips, especially from Ball Grid Array (BGA) components. This technique does not need any heating of the chip component, as opposed to infrared or hot air de-soldering. In addition, it avoids the need of re-balling BGA in case of missing balls at the wrong place. Thus it enhances the quality and integrity of the data extraction. However, this technique is destructive for the device motherboard and has limitations when memory chip content is encrypted. The technique works by subtracting matter by micro-milling, without heating. The technique has been extensively used in about fifty real cases for more than one year. It is named frigida via, compared to the calda via of infrared heating.